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Jiangxi Sanxin Hi-Tech Ceramics Co., Ltd.
AlN DBC
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Introduction of AlN DBC Substrate

AlN combines excellent thermal conductivity with good mechanical stability. Another advantage of AlN compared to Al2O3 is its thermal expansion coefficient, which is closer to that of silicon, and thus hardly causes any thermal tension in the solder layer between the chip and the substrate. DBC substrates based on AlN ceramics are mainly used in applications with very high operational voltages at high partial discharge resistance and very high reliability prerequisites, such as: Train drives; Aerospace industry; Industrial semiconductor modules with high power density.

Specifications of AlN DBC Substrate

Property

Value

Model

LDAB020

Dimension

(inch x inch)

4.5x4.5

6x6

5.5x7.5

(mm x mm)

114.3x114.3

152.4x152.4

139.7x190.5

Tile thickness(mm)

0.385/0.635/1.0

Copper thickness(mm)

0.3

Ceramic thermal conductivity(25℃, W/(m.k))

20~25

Copper Type

Cu110

Copper peel strength(psi)

>80

Bond

Cu/CuO Eutectic type

Flexural strength(Mpa)

400-450

Note: Special order can be customized.

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